Get 3D IC Stacking Technology PDF

By Banqiu Wu, Ajay Kumar, Sesh Ramaswami

ISBN-10: 007174195X

ISBN-13: 9780071741958

The most up-to-date advances in 3-dimensional built-in circuit stacking technology

With a spotlight on business functions, 3D IC Stacking Technology bargains accomplished insurance of layout, try out, and fabrication processing tools for three-d gadget integration. each one bankruptcy during this authoritative consultant is written through specialists and info a separate fabrication step. destiny functions and state of the art layout strength also are mentioned. this is often a necessary source for semiconductor engineers and conveyable equipment designers.

3D IC Stacking Technology covers:

  • High density via silicon stacking (TSS) technology
  • Practical layout surroundings for heterogeneous 3D IC products
  • Design automation and TCAD instrument ideas for via silicon through (TSV)-based 3D IC stack
  • Process integration for TSV manufacturing
  • High-aspect-ratio silicon etch for TSV
  • Dielectric deposition for TSV
  • Barrier and seed deposition
  • Copper...
  • Show description

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    This limitation of liability shall apply to any claim or cause whatsoever whether such claim or cause arises in contract, tort or otherwise. , Santa Clara, California (CHAP. , Chandler, Arizona (CHAP. , Chandler, Arizona (CHAP. , Sunnyvale, California (CHAP. , Sunnyvale, California (CHAP. , Sunnyvale, California (CHAP. , Chandler, Arizona (CHAP. , Sunnyvale, California (CHAP. , Chandler, Arizona (CHAP. , Chandler, Arizona (CHAP. , Sunnyvale, California (CHAP. , Mountain View, California (CHAP. , Phoenix, Arizona (CHAP.

    Via-first TSVs generally do not have a wide range of applications due to their high via resistance. Via-last has applications in which the limited via density is sufficient to provide interconnect required for chip-to-chip stacking to achieve form factor reduction. Via-middle is viewed as the preferred approach for high-density TSVs in many applications, since it can provide low-resistance, high-density interconnects with orders of magnitude more connections between chips than are possible with wirebonds.

    1 shows a representative taxonomy of the research materials, devices, and architectures being considered in the semiconductor industry from the 2009 International Technology Roadmap for Semiconductors [1]. In response to this challenging nanoelectronics landscape and erosion of the value proposition for continuing CMOS scaling, one growing trend is to derive product differentiation from package integration and system architecture, rather than relying primarily on CMOS scaling. The current focus on system-on-chip (SOC) to integrate digital logic, memory, and analog/RF functions utilizes CMOS scaling to miniaturize the transistors and their interconnections on a single chip.

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    3D IC Stacking Technology by Banqiu Wu, Ajay Kumar, Sesh Ramaswami

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